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MAX253ESA+ - Analog Devices

Description: MAX253ESA+, MOSFET Power Driver,, 8-Pin SOIC

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MAX253ESA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX253ESA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8 SO-3
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3D Models
MAX253ESA+ - Analog Devices - 3D model - Small Outline Packages - 8 SO-3
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MAX253ESA+ Details

  • Manufacturer Part Number:

    MAX253ESA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    ROHS COMPLIANT, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1994-01-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX253ESA+ Frequently Asked Questions (FAQs)

  • The MAX253ESA+ is a high-frequency device, and proper layout and placement are crucial to minimize EMI and noise. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. Additionally, it is recommended to use a shielded enclosure and to keep the device away from other noise-generating components.
  • To ensure the MAX253ESA+ is properly biased and configured, it is recommended to follow the application circuit provided in the datasheet and to consult the device's evaluation board documentation. Additionally, it is recommended to consult with an experienced analog design engineer or to contact Analog Devices' technical support team for guidance on specific application requirements.
  • The MAX253ESA+ has a maximum junction temperature of 150°C, and it is recommended to ensure that the device operates within its recommended temperature range to prevent thermal shutdown. Thermal considerations include providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. It is also recommended to follow the thermal design guidelines provided in the datasheet and to consult with a thermal design expert if necessary.
  • To troubleshoot common issues with the MAX253ESA+, it is recommended to follow a systematic approach, including checking the device's power supply, input and output signals, and PCB layout. It is also recommended to consult the datasheet and application notes, and to use simulation tools such as SPICE to model the circuit and identify potential issues. Additionally, it is recommended to consult with an experienced analog design engineer or to contact Analog Devices' technical support team for guidance on troubleshooting specific issues.
  • The MAX253ESA+ has built-in ESD protection, but it is still recommended to follow proper ESD handling and protection procedures to prevent damage to the device. This includes using ESD-safe workstations, handling the device by the body rather than the leads, and using ESD-protective packaging and storage materials. It is also recommended to follow the ESD handling guidelines provided in the datasheet and to consult with an ESD expert if necessary.

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MAX253ESA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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