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MAX2688EWS+T - Analog Devices

Description: RF Amplifier GPS/GNSS Low-Noise Amplifier

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MAX2688EWS+T - Analog Devices PCB footprint - BGA - BGA - W40A0+1
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MAX2688EWS+T - Analog Devices  - 3D model - BGA - W40A0+1
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MAX2688EWS+T Details

  • Manufacturer Part Number:

    MAX2688EWS+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    4-WLCSP-N/A

  • Pin Count:

    4

  • Manufacturer Package Code:

    4-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2010-08-13

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.84 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max (Vsup):

    3.3 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    2.85 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.84 mm

MAX2688EWS+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX2688EWS+T involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the antenna. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the RF signal, a layer for the power supply, a layer for the ground, and a layer for the digital signals.
  • The value of the external bias resistor (RBIAS) depends on the desired output power and the voltage supply. A higher value of RBIAS results in lower output power, while a lower value results in higher output power. The recommended value of RBIAS is typically between 1kΩ and 10kΩ. Consult the datasheet and application notes for more information.
  • The MAX2688EWS+T has an operating temperature range of -40°C to +85°C. However, the device's performance may degrade at higher temperatures, and it's recommended to operate the device within a temperature range of -20°C to +70°C for optimal performance.
  • No, the MAX2688EWS+T is not suitable for use in switching power supply applications. It's designed for use in wireless communication systems, such as Wi-Fi, Bluetooth, and Zigbee, and is optimized for low noise and high linearity. Using it in a switching power supply application may result in poor performance and reliability issues.
  • To troubleshoot common issues with the MAX2688EWS+T, start by checking the PCB layout and ensuring that it meets the recommended layout guidelines. Next, verify that the input and output impedance matching is correct, and that the device is properly biased. Also, check the power supply voltage and ensure that it's within the recommended range. If the issue persists, consult the datasheet and application notes for more troubleshooting tips.

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MAX2688EWS+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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