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MAX2829ETN+T - Analog Devices

Description: Single-/Dual-Band 802.11a/b/g World-Band Transceiver ICs

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PCB Footprints
MAX2829ETN+T - Analog Devices PCB footprint - Other - Other - QFN50P800X800X80-57N
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MAX2829ETN+T - Analog Devices  - 3D model - Other - QFN50P800X800X80-57N
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MAX2829ETN+T Details

  • Manufacturer Part Number:

    MAX2829ETN+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    56-LFCSP-8X8X0.75

  • Package Description:

    HVQCCN,

  • Pin Count:

    56

  • Manufacturer Package Code:

    56-LFCSP-8X8X0.75

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-11-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

MAX2829ETN+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX2829ETN+T involves keeping the RF signal paths as short as possible, using a solid ground plane, and placing the device close to the antenna. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the RF signal, a layer for the ground plane, and two layers for the power supply and digital signals.
  • The MAX2829ETN+T can be configured for different frequency bands by adjusting the values of the external components, such as the inductors and capacitors, according to the specific frequency band requirements. The device also has a programmable frequency synthesizer that can be controlled through the SPI interface.
  • The maximum power consumption of the MAX2829ETN+T depends on the operating mode and the frequency band. According to the datasheet, the maximum power consumption is around 220mA in transmit mode and 40mA in receive mode. However, the actual power consumption may vary depending on the specific application and operating conditions.
  • The MAX2829ETN+T has a built-in antenna diversity feature that can be enabled through the SPI interface. The device can be connected to two antennas, and the antenna diversity algorithm can be configured to select the best antenna based on the signal strength and quality.
  • The MAX2829ETN+T supports a maximum data rate of up to 3.6Mbps, depending on the modulation scheme and the frequency band. The device supports various modulation schemes, including GFSK, FSK, and OOK.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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