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MAX30001GCWV+ - Analog Devices

Description: Ultra-Low-Power, Single-Channel Integrated Biopotential (ECG and R-to-R) and Bioimpedance (Resp, GSR/EDA) AFE

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MAX30001GCWV+ - Analog Devices - PCB symbol
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PCB Footprints
MAX30001GCWV+ - Analog Devices PCB footprint - BGA - BGA - W302L2+1
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3D Models
MAX30001GCWV+ - Analog Devices - 3D model - BGA - W302L2+1
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MAX30001GCWV+ Details

  • Manufacturer Part Number:

    MAX30001GCWV+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    30-WLCSP-N/A

  • Package Description:

    WLP-30

  • Pin Count:

    30

  • Manufacturer Package Code:

    30-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2022-01-05

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PBGA-B30

  • Length:

    2.926 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA30,5X6,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Max:

    2 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.74 mm

MAX30001GCWV+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX30001GCWV+ is to use a 4-layer board with a solid ground plane, and to keep the analog and digital signals separate. The device's exposed pad should be connected to a solid ground plane to ensure good thermal and electrical performance.
  • To optimize the MAX30001GCWV+ for low power consumption, use the lowest possible clock frequency, disable the internal oscillator and use an external clock source, and put the device in shutdown mode when not in use. Additionally, use a low-power mode for the ADC and reduce the sampling rate.
  • The maximum allowed capacitance for the input pins of the MAX30001GCWV+ is 10nF. Exceeding this value may affect the device's performance and accuracy.
  • The MAX30001GCWV+ is rated for operation up to 125°C, but it's recommended to derate the device's performance and accuracy at high temperatures. Consult the datasheet for specific temperature-related specifications and guidelines.
  • To ensure EMC with the MAX30001GCWV+, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, follow proper PCB layout and grounding practices.

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MAX30001GCWV+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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