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MAX3051ESA+ - Analog Devices

Description: CAN Transceiver 1 Mbit/s ISO 11898 Standby-Mode 8pins SOIC

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MAX3051ESA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX3051ESA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8+4
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3D Models
MAX3051ESA+ - Analog Devices - 3D model - Small Outline Packages - S8+4
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MAX3051ESA+ Details

  • Manufacturer Part Number:

    MAX3051ESA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-05-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3051ESA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3051ESA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, using a shielded enclosure and keeping the device away from high-frequency sources can help minimize EMI and noise.
  • To ensure accuracy in high-temperature environments, it's essential to consider the device's temperature coefficient and compensate for it in the design. Additionally, using a thermocouple or thermistor to measure the temperature and adjusting the gain accordingly can help maintain accuracy.
  • The recommended power-up sequence for the MAX3051ESA+ is to power up the analog supply (VCC) before the digital supply (VDD). This ensures that the analog circuitry is powered up before the digital circuitry, preventing latch-up or damage.
  • To troubleshoot issues with the MAX3051ESA+, start by checking the power supplies, ensuring that VCC and VDD are within the recommended ranges. Next, verify that the input signals are within the specified ranges and that the device is properly configured. If issues persist, check for noise or EMI interference and ensure that the PCB layout is optimal.
  • Yes, the MAX3051ESA+ can be used in a differential configuration. To do so, connect the IN+ pin to the positive input signal and the IN- pin to the negative input signal. Ensure that the common-mode voltage is within the specified range, and adjust the gain accordingly to achieve the desired output.

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MAX3051ESA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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