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MAX3057ASA+ - Analog Devices

Description: CAN Transceiver 2Mbit/s ISO 11898 Sleep, Standby-Mode 8pins SOIC

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MAX3057ASA+ - Analog Devices - PCB symbol
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MAX3057ASA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8 SO-3
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3D Models
MAX3057ASA+ - Analog Devices - 3D model - Small Outline Packages - 8 SO-3
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MAX3057ASA+ Details

  • Manufacturer Part Number:

    MAX3057ASA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    0.150 INCH, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2002-11-14

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3057ASA+ Frequently Asked Questions (FAQs)

  • A good PCB layout practice for the MAX3057ASA+ is to keep the analog and digital grounds separate, use a solid ground plane, and keep the signal traces short and away from noise sources. Additionally, use a common-mode filter or a ferrite bead to filter out high-frequency noise on the input lines.
  • To ensure accuracy in high-temperature applications, it's essential to consider the temperature coefficient of the device and the thermal resistance of the package. The MAX3057ASA+ has a temperature coefficient of ±0.5°C/°C, and the package has a thermal resistance of 30°C/W. Ensure good thermal management by providing adequate heat sinking and airflow around the device.
  • The maximum cable length that can be used with the MAX3057ASA+ depends on the frequency of the signal, the type of cable, and the termination used. As a general rule, keep the cable length as short as possible (less than 1 meter) and use a shielded twisted-pair cable with a 100-ohm termination to minimize signal reflections and noise.
  • Yes, the MAX3057ASA+ can be used in a redundant or fault-tolerant system. The device has a built-in fault detection feature that can detect open-circuit, short-circuit, and over-temperature conditions. You can use this feature to implement a redundant system that can switch to a backup channel in case of a fault.
  • The MAX3057ASA+ does not require calibration. It is a plug-and-play device that is calibrated at the factory. However, you may need to adjust the gain and offset of the device to match your specific application requirements. This can be done using the device's built-in gain and offset adjustment pins.

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MAX3057ASA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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