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MAX309ESE+ - Analog Devices

Description: Maxim MAX309ESE+, Multiplexer Switch IC Dual 4 x 2, 12 V, 16-Pin SOIC s16+5

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MAX309ESE+ - Analog Devices - PCB symbol
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PCB Footprints
MAX309ESE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S16+5
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3D Models
MAX309ESE+ - Analog Devices - 3D model - Small Outline Packages - S16+5
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MAX309ESE+ Details

  • Manufacturer Part Number:

    MAX309ESE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_N-150_MIL

  • Package Description:

    SO-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2000-12-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -20 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    1.5 Ω

  • On-state Resistance-Max (Ron):

    100 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.075 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    150 ns

  • Switch-on Time-Max:

    150 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX309ESE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX309ESE+ involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing the device close to the signal source. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance.
  • To ensure reliable operation of the MAX309ESE+ in high-temperature environments, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device's junction temperature below the recommended maximum of 150°C. Additionally, consider using a thermal interface material between the device and the heat sink to improve heat transfer.
  • The maximum cable length supported by the MAX309ESE+ depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at data rates up to 100 Mbps. For longer cable lengths or higher data rates, it's recommended to use repeaters or active cables to maintain signal integrity.
  • Yes, the MAX309ESE+ can be used in a redundant or fault-tolerant system. The device's built-in fault detection and reporting features make it suitable for use in high-reliability applications. Additionally, the device's hot-swappable design allows for easy replacement in the event of a failure, minimizing system downtime.
  • Common issues with the MAX309ESE+ can be troubleshooted by checking the device's power supply, signal integrity, and PCB layout. Ensure that the device is properly powered and that the signal lines are properly terminated. Also, check for any signs of overheating, such as excessive current consumption or high junction temperatures. If issues persist, consult the device's datasheet and application notes for further guidance.

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MAX309ESE+ Overview

Use the download button to access the MAX309ESE+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX30, or try a keyword search, such as Multiplexers or Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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For a full list of alternate parts for MAX309ESE+, check out Findchips.com