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MAX31331TETB+ - Analog Devices

Description: Ultra-Low power 12C Real Time clock w/ power management in TDFN

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MAX31331TETB+ - Analog Devices - PCB symbol
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PCB Footprints
MAX31331TETB+ - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - T1033+1C
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3D Models
MAX31331TETB+ - Analog Devices - 3D model - Small Outline No-lead - T1033+1C
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MAX31331TETB+ Details

  • Manufacturer Part Number:

    MAX31331TETB+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    10-LFCSP-3X3X0.75

  • Package Description:

    TDFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    10-LFCSP-3X3X0.75

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2022-04-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Clock Frequency-Max:

    0.032 MHz

  • Information Access Method:

    SERIAL(I2C)

  • Interrupt Capability:

    Y

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSON

  • Package Equivalence Code:

    SOLCC10,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time-Min:

    SECONDS

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Volatile:

    YES

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    TIMER, REAL TIME CLOCK

MAX31331TETB+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX31331TETB+ can be found in the MAX31331 Evaluation Kit documentation, which provides a detailed layout guide and Gerber files for reference. Additionally, Analog Devices provides a PCB layout checklist in the datasheet that highlights key considerations for optimal performance.
  • To optimize the crystal oscillator circuit, ensure that the crystal resonator is properly matched to the internal oscillator circuitry. Follow the crystal selection guidelines in the datasheet, and use a crystal with a load capacitance of 18pF to 22pF. Additionally, minimize the distance between the crystal and the IC, and use a low-impedance connection to reduce noise and ensure reliable startup.
  • The MAX31331TETB+ is specified to operate from -40°C to +125°C, but it can be operated at temperatures up to 150°C with reduced performance and reliability. However, it's essential to note that the device's accuracy and stability may degrade at higher temperatures, and the user should consult the datasheet and application notes for guidance on operating the device at elevated temperatures.
  • To ensure EMC with the MAX31331TETB+, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering techniques to reduce electromagnetic radiation. Additionally, ensure that the device is properly decoupled, and use a low-pass filter on the power supply lines to reduce noise and interference.
  • The recommended power-up sequence for the MAX31331TETB+ is to apply the power supply voltage (VCC) before the crystal oscillator is enabled. This ensures that the internal voltage regulators are properly initialized before the oscillator is started. Additionally, ensure that the power supply voltage is stable and within the recommended operating range before enabling the oscillator.

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MAX31331TETB+ Overview

Use the download button to access the MAX31331TETB+ schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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