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MAX31629MTA+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX31629MTA+T - TEMPERATURE SENSOR, 2DEG C, TDFN-8

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MAX31629MTA+T - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - T833+2 (8 TDFN)
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MAX31629MTA+T - Analog Devices  - 3D model - Small Outline No-lead - T833+2 (8 TDFN)
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MAX31629MTA+T Details

  • Manufacturer Part Number:

    MAX31629MTA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LFCSP-3X3X0.75

  • Package Description:

    ROHS COMPLIANT, TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2014-03-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX31629MTA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31629MTA+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the battery to minimize noise. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the accuracy of the battery fuel gauge, it's essential to calibrate the device during manufacturing. This involves charging and discharging the battery multiple times to teach the device the battery's characteristics. Additionally, the device should be configured to periodically update its battery model to account for aging and other environmental factors.
  • The MAX31629MTA+T has an operating temperature range of -40°C to +85°C. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and accuracy.
  • The MAX31629MTA+T is designed to work with rechargeable batteries, and its fuel gauge algorithm is optimized for rechargeable batteries. While it may be possible to use the device with a non-rechargeable battery, the fuel gauge accuracy may not be optimal, and the device's performance may be affected.
  • To troubleshoot issues with the MAX31629MTA+T, start by checking the device's configuration and settings to ensure they are correct. Then, use the device's built-in diagnostic features, such as the fault register, to identify the source of the issue. If the problem persists, consult the device's datasheet and application notes, or contact Analog Devices' technical support team for assistance.

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MAX31629MTA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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