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MAX31730ATC+T - Analog Devices

Description: Board Mount Temperature Sensors TRIPLE REMOTE TEMP SENSOR TDFN TR

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MAX31730ATC+T - Analog Devices - PCB symbol
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PCB Footprints
MAX31730ATC+T - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - TD1233+1C
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3D Models
MAX31730ATC+T - Analog Devices - 3D model - Small Outline No-lead - TD1233+1C
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MAX31730ATC+T Details

  • Manufacturer Part Number:

    MAX31730ATC+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    12-LFCSP-3X3X0.75

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, TDFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    12-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    2014-03-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Accuracy-Max (Cel):

    2.5 Cel

  • Body Breadth:

    3 mm

  • Body Height:

    0.75 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    12

  • Number of Terminals:

    12

  • Operating Current-Max:

    1.2 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX31730ATC+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31730ATC+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value of at least 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value of at least 22uF. The capacitor values and types should be chosen based on the specific application requirements and the device's operating frequency.
  • The MAX31730ATC+T has an operating ambient temperature range of -40°C to +125°C, but the device's performance and reliability may be affected at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
  • The MAX31730ATC+T has a specific power-up and power-down sequence that should be followed to ensure proper operation. The device should be powered up by applying the input voltage to the VIN pin, followed by the enable signal to the EN pin. During power-down, the enable signal should be removed before the input voltage is removed.
  • The recommended input voltage range for the MAX31730ATC+T is 2.7V to 5.5V, but the device can operate with input voltages as low as 2.5V and as high as 6V. However, the device's performance and efficiency may be affected at input voltages outside the recommended range.

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MAX31730ATC+T Overview

Use the download button to access the MAX31730ATC+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX31, or try a keyword search, such as Temperature Sensors

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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