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MAX31760AEE+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX31760AEE+ - PWM FAN CONTROLLER, 3.6V, QSOP-16

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MAX31760AEE+ - Analog Devices - PCB symbol
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PCB Footprints
MAX31760AEE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MAX 21-0055_O
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MAX31760AEE+ - Analog Devices - 3D model - Small Outline Packages - MAX 21-0055_O
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MAX31760AEE+ Details

  • Manufacturer Part Number:

    MAX31760AEE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Philippines, Thailand

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2014-05-06

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.89 mm

MAX31760AEE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31760AEE+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value of at least 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value of at least 22uF. The capacitor values and types should be chosen based on the specific application requirements and operating conditions.
  • The MAX31760AEE+ is rated for operation over a temperature range of -40°C to +125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. A derating curve is provided in the datasheet to help determine the maximum ambient temperature for a given power dissipation.
  • The MAX31760AEE+ has a specific power-up and power-down sequence that must be followed to ensure proper operation. The device should be powered up by applying the input voltage to the VIN pin, followed by the enable signal to the EN pin. When powering down, the enable signal should be removed first, followed by the input voltage.
  • The MAX31760AEE+ is capable of delivering up to 1.5A of output current, but the actual output current capability depends on the input voltage, output voltage, and ambient temperature. The device's thermal performance and power dissipation should be considered when determining the maximum output current.

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MAX31760AEE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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