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MAX31855EASA+ - Analog Devices

Description: Sensor Interface Cold-Junction Compensated Thermocouple-to-Digital Convert E TYPE

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MAX31855EASA+ - Analog Devices - PCB symbol
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MAX31855EASA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8+4
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MAX31855EASA+ - Analog Devices - 3D model - Small Outline Packages - S8+4
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MAX31855EASA+ Details

  • Manufacturer Part Number:

    MAX31855EASA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    ROHS COMPLIANT, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2011-04-05

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX31855EASA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31855EASA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the thermocouple and RTD inputs close to the device. A 4-layer PCB with a dedicated analog layer is recommended. See the MAX31855EASA+ evaluation board layout as a reference.
  • The MAX31855EASA+ has an internal CJC sensor, but it's recommended to use an external CJC sensor for higher accuracy. Connect the external CJC sensor to the CJCIN pin and ensure it's thermally coupled to the thermocouple junction. The device will automatically use the external CJC sensor if it's connected.
  • A 0.1uF to 1uF ceramic capacitor is recommended for the VDD pin to filter out noise and ensure stable operation. The capacitor should be placed as close to the VDD pin as possible.
  • The device can be configured for RTD or thermocouple mode through the SPI interface. Write the appropriate configuration data to the CFG register (address 0x00) to select the desired mode. Refer to the datasheet for the specific configuration bits and values.
  • The maximum cable length for the thermocouple inputs depends on the specific thermocouple type, cable material, and noise environment. As a general guideline, keep the cable length as short as possible (less than 10 feet) to minimize noise pickup and ensure accurate measurements.

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MAX31855EASA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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