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MAX32651GCE+ - Analog Devices

Description: Ultra-Low-Power Arm Cortex-M4 with FPU-Based Microcontroller (MCU)with 3MB Flash and 1MB SRAM

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MAX32651GCE+ - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - 144 TQFP
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MAX32651GCE+ - Analog Devices  - 3D model - Quad Flat Packages - 144 TQFP
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MAX32651GCE+ Details

  • Manufacturer Part Number:

    MAX32651GCE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    144-TQFP-20X20X1.0

  • Package Description:

    TQFP-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    144-TQFP-20X20X1.0

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2018-03-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    0.032 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of I/O Lines:

    73

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    144

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP144,.87SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • RAM (bytes):

    1048576

  • ROM (words):

    3145728

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    120 MHz

  • Supply Voltage-Max:

    1.21 V

  • Supply Voltage-Min:

    0.99 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MAX32651GCE+ Frequently Asked Questions (FAQs)

  • The recommended crystal oscillator frequency for the MAX32651GCE+ is 32.768 kHz, which is used as the clock source for the real-time clock (RTC) and other peripherals.
  • To configure the MAX32651GCE+ for low-power operation, you can use the Power Mode Controller (PMC) to select the desired power mode (e.g., sleep, deep sleep, or shutdown). You can also use the Clock Controller (CLK) to gate clocks to peripherals and reduce power consumption.
  • The maximum operating temperature range for the MAX32651GCE+ is -40°C to +85°C, although the device can be operated at temperatures up to 105°C for short periods of time (e.g., during device startup).
  • The MAX32651GCE+ has an external memory interface (EMI) that allows it to access external memory devices such as flash, SRAM, or SDRAM. To use an external memory, you need to configure the EMI to match the memory device's timing and interface requirements.
  • The maximum current consumption of the MAX32651GCE+ depends on the operating mode and the peripherals enabled. In active mode, the maximum current consumption is approximately 150 mA. In sleep mode, the current consumption is typically in the range of 10-50 μA.

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MAX32651GCE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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