MAX33053EASA+ footprint, schematic symbol and 3D model by Analog Devices

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Part Number MAX33053EASA+
Manufacturer Analog Devices
Pin Count 8
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - S8+4
Released Date Jul 3, 2026
Last Modified Date Jul 3, 2026 2:20 AM UTC
Pinout / Pin List Click Here (Member Only)

MAX33053EASA+ Details

Manufacturer Part Number:
MAX33053EASA+
Brand Name:
Analog Devices Inc
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
8-SOIC_N-150_MIL
Pin Count:
8
Manufacturer Package Code:
8-SOIC_N-150_MIL
Country Of Origin:
Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA
HTS Code:
8542.39.00.01
Date Of Intro:
2018-08-23
Manufacturer:
Analog Devices Inc
YTEOL:
9
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Peak Reflow Temperature (Cel):
260
Telecom IC Type:
INTERFACE CIRCUIT
Terminal Finish:
Matte Tin (Sn) - annealed
Time@Peak Reflow Temperature-Max (s):
30

MAX33053EASA+ Frequently Asked Questions (FAQs)

A good PCB layout for the MAX33053EASA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to keep the signal traces short and direct.
The MAX33053EASA+ requires a single 3.3V power supply, and it's recommended to use a low-noise, low-dropout regulator (LDO) to power the device. The power sequencing requirements are not critical, but it's recommended to power up the device after the power supply has stabilized.
The MAX33053EASA+ can achieve a maximum data rate of 100Mbps, but this is limited by the device's internal clock frequency and the quality of the transmission line. The actual data rate may be lower depending on the specific application and the signal integrity.
The MAX33053EASA+ can be configured for different data transmission modes using the device's control pins and registers. For example, the device can be configured for half-duplex mode by tying the RXEN pin high and the TXEN pin low, while full-duplex mode can be achieved by tying both pins high.
The MAX33053EASA+ has a maximum junction temperature of 150°C, and it's recommended to keep the device temperature below 125°C for optimal performance. Thermal management considerations include using a heat sink, ensuring good airflow, and avoiding high-power dissipation in the surrounding components.

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MAX33053EASA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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