MAX3373EEBL+T - Analog Devices

MAX3373EEBL+T Details

• Manufacturer Part Number:

  MAX3373EEBL+T

• Brand Name:

  Analog Devices Inc

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  N/A

• Package Description:

  UCSP-9

• Pin Count:

  9

• Manufacturer Package Code:

  N/A

• Reach Compliance Code:

  Compliant

• Country Of Origin:

  Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.60

• Date Of Intro:

  2002-01-03

• Manufacturer:

  Analog Devices Inc

• YTEOL:

  9

• Additional Feature:

  USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

• Delay-Max:

  1600 ns

• Input Characteristics:

  STANDARD

• Interface IC Type:

  VOLTAGE LEVEL TRANSLATOR

• JESD-30 Code:

  S-PBGA-B9

• JESD-609 Code:

  e1

• Length:

  1.52 mm

• Moisture Sensitivity Level:

  1

• Number of Bits:

  1

• Number of Functions:

  4

• Number of Terminals:

  9

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output Characteristics:

  OPEN-DRAIN

• Output Latch or Register:

  NONE

• Output Polarity:

  TRUE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA9,3X3,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.67 mm

• Supply Current-Max:

  0.3 mA

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  1.2 V

• Supply Voltage-Nom:

  3.3 V

• Supply Voltage1-Max:

  5.5 V

• Supply Voltage1-Min:

  1.65 V

• Supply Voltage1-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  BICMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.52 mm