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MAX3378EETD+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3378EETD+T - Low-Voltage Level Translator, 4 Input, 210 ns, 1.65 V to 5.5 V, TDFN-14

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PCB Footprints
MAX3378EETD+T - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - T1433+2
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MAX3378EETD+T - Analog Devices  - 3D model - Small Outline No-lead - T1433+2
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MAX3378EETD+T Details

  • Manufacturer Part Number:

    MAX3378EETD+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-LFCSP-3X3X0.75

  • Package Description:

    TDFN-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-01-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

  • Delay-Max:

    1600 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-N14

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.12,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX3378EETD+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3378EETD+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper power-up and initialization of the MAX3378EETD+T, make sure to follow the recommended power-up sequence, which involves applying the power supply voltage (VCC) before the input signal. Also, ensure that the input signal is within the specified range and that the device is properly configured through the EN and SEL pins.
  • The MAX3378EETD+T has a maximum junction temperature of 150°C. To prevent overheating, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and keep the device away from other heat sources. Also, make sure to follow the recommended operating conditions and avoid exceeding the maximum power dissipation.
  • To troubleshoot issues with the MAX3378EETD+T, start by verifying the input signal and power supply voltage. Check for proper PCB layout and component placement, and ensure that the device is properly configured. Use an oscilloscope to measure the output voltage and input signal, and check for any signs of oscillation or instability. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • The MAX3378EETD+T is a high-reliability device, but it's essential to follow proper design and testing procedures to ensure its suitability for safety-critical applications. Consult the datasheet and relevant industry standards (e.g., IEC 61508, ISO 26262) for guidance on designing and verifying safety-critical systems. Additionally, consider using redundant or fail-safe designs to mitigate potential failures.

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MAX3378EETD+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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