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MAX3379EEUD+ - Analog Devices

Description: Maxim MAX3379EEUD+, Logic Level Translator, Voltage Level, 3-State, 1.65 → 5.5 V, 14-Pin TSSOP

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MAX3379EEUD+ - Analog Devices - PCB symbol
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PCB Footprints
MAX3379EEUD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP
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3D Models
MAX3379EEUD+ - Analog Devices - 3D model - Small Outline Packages - TSSOP
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MAX3379EEUD+ Details

  • Manufacturer Part Number:

    MAX3379EEUD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-TSSOP_4.4-4.4_MM

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2002-01-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

  • Delay-Max:

    1600 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.65 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MAX3379EEUD+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3379EEUD+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper power-up and power-down of the MAX3379EEUD+, it's recommended to follow a controlled power-up sequence, where the input voltage is applied before the enable pin is asserted. During power-down, the enable pin should be de-asserted before the input voltage is removed. This helps prevent unwanted current surges and ensures reliable operation.
  • The MAX3379EEUD+ can drive capacitive loads up to 10nF, but it's recommended to limit the load capacitance to 1nF or less to ensure stable operation and prevent oscillations. Exceeding the recommended capacitive load may result in reduced performance, oscillations, or even device damage.
  • To troubleshoot issues with the MAX3379EEUD+, start by verifying the power supply and input voltage, then check the enable pin and output voltage. Use an oscilloscope to monitor the output voltage and look for signs of oscillation or instability. Also, check the PCB layout and ensure that it meets the recommended layout guidelines. If the issue persists, consult the datasheet and application notes for further guidance.
  • The MAX3379EEUD+ is rated for operation up to 125°C, but it's recommended to derate the device's performance and power dissipation at higher temperatures. Ensure that the device is properly heatsinked and that the PCB is designed to handle high temperatures. Consult the datasheet and application notes for specific guidance on high-temperature operation.

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MAX3379EEUD+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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