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MAX3645EEE+ - Analog Devices

Description: Maxim MAX3645EEE+, RF Amplifier Limiting, 16-Pin QSOP

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MAX3645EEE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - E16+1_(height=1.73)_1
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MAX3645EEE+ - Analog Devices  - 3D model - Small Outline Packages - E16+1_(height=1.73)_1
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MAX3645EEE+ Details

  • Manufacturer Part Number:

    MAX3645EEE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    0.150 INCH, 0.025 INCH PITCH, LEAD FREE, MO-137AB, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2003-11-10

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Applications:

    SONET

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.027 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    ATM/SONET/SDH SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3645EEE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3645EEE+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
  • To ensure proper power-up and power-down of the MAX3645EEE+, it's essential to follow a controlled power-up sequence. The device should be powered up in the following order: VCC, VDD, and then VIN. During power-down, the sequence should be reversed. Additionally, the power supplies should be ramped up and down slowly to prevent voltage spikes and ensure a clean shutdown.
  • The MAX3645EEE+ has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, and use a heat sink if necessary. The device's thermal pad should be connected to a solid ground plane to help dissipate heat. Additionally, follow the thermal design guidelines provided in the datasheet and application notes.
  • Yes, the MAX3645EEE+ can be used in high-vibration environments, but it's essential to ensure the device is properly secured to the PCB using a suitable mounting method, such as a surface-mount or through-hole package. Additionally, the PCB should be designed to withstand the vibration, and the device's pins should be secured using a suitable conformal coating or potting compound.
  • To troubleshoot issues with the MAX3645EEE+, start by verifying the power supply voltages and ensuring the device is properly powered up. Check the input and output signals using an oscilloscope, and verify that the device is configured correctly. Common pitfalls to avoid include incorrect power sequencing, inadequate decoupling, and poor PCB layout. Consult the datasheet and application notes for troubleshooting guidelines and common error scenarios.

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MAX3645EEE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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