MAX3669ETG+ - Analog Devices

MAX3669ETG+ Details

• Manufacturer Part Number:

  MAX3669ETG+

• Brand Name:

  Analog Devices Inc

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Part Package Code:

  24-LFCSP-4X4X0.75

• Package Description:

  4 X 4 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-24

• Pin Count:

  24

• Manufacturer Package Code:

  24-LFCSP-4X4X0.75

• Country Of Origin:

  Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

• HTS Code:

  8542.39.00.01

• Date Of Intro:

  1999-10-23

• Manufacturer:

  Analog Devices Inc

• YTEOL:

  3

• Interface IC Type:

  INTERFACE CIRCUIT

• JESD-30 Code:

  S-XQCC-N24

• JESD-609 Code:

  e3

• Length:

  4 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  24

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC24,.16SQ,20

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.8 mm

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  3.14 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn) - annealed

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  4 mm