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MAX3738ETG+ - Analog Devices

Description: Maxim,MAX3738ETG+ Maxim MAX3738ETG+ -0.5 → 6 V Laser Driver

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PCB Footprints
MAX3738ETG+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - TQFN-24(T2444-3)
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3D Models
MAX3738ETG+ - Analog Devices  - 3D model - Quad Flat No-Lead - TQFN-24(T2444-3)
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MAX3738ETG+ Details

  • Manufacturer Part Number:

    MAX3738ETG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    24-LFCSP-4X4X0.75

  • Package Description:

    TQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-02-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX3738ETG+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3738ETG+ should include a solid ground plane, short and wide traces for the high-frequency signals, and a decoupling capacitor (e.g., 0.1uF) between VCC and GND. Additionally, keep the analog and digital signals separate to minimize noise coupling.
  • The values of RSET and RFB depend on the desired output voltage and current. Use the equations provided in the datasheet to calculate the values. Typically, RSET is around 1kΩ to 10kΩ, and RFB is around 10kΩ to 100kΩ. You can also use the MAX3738ETG+ evaluation board as a reference.
  • The MAX3738ETG+ can handle input voltages up to 5.5V, but it's recommended to keep the input voltage below 5V to ensure reliable operation and to prevent damage to the device.
  • The MAX3738ETG+ is rated for operation up to 125°C, but it's recommended to derate the output current and voltage at higher temperatures to ensure reliable operation. Consult the datasheet for more information on thermal derating.
  • Check the input voltage, output voltage, and output current using an oscilloscope or a multimeter. Verify that the external resistors (RSET and RFB) are correctly valued and that the PCB layout is correct. Also, check for any signs of overheating or damage to the device.

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MAX3738ETG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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