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MAX3869EHJ+ - Analog Devices

Description: Laser Drivers +3.3V, 2.5Gbps SDH/SONET Laser Driver with Current Monitors and APC

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MAX3869EHJ+ - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - 32L,TQFP.EPS
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MAX3869EHJ+ - Analog Devices  - 3D model - Quad Flat Packages - 32L,TQFP.EPS
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MAX3869EHJ+ Details

  • Manufacturer Part Number:

    MAX3869EHJ+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    32-TQFP_EP-5X5X1.0

  • Package Description:

    5 X 5 MM, 1 MM HEIGHT, ROHS COMPLIANT, MS-026AAA-HD, TQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-TQFP_EP-5X5X1.0

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1999-12-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP32,.28SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.14 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX3869EHJ+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3869EHJ+ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To optimize the performance of the MAX3869EHJ+ in a noisy environment, use a low-pass filter at the input, add a ferrite bead or a common-mode choke to the power supply lines, and use a shielded enclosure to reduce electromagnetic interference (EMI).
  • The maximum power dissipation of the MAX3869EHJ+ is dependent on the operating temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated to 0.7W at 85°C.
  • Yes, the MAX3869EHJ+ can be used in a battery-powered device. It has a low quiescent current of 1.5mA, making it suitable for battery-powered applications. However, the device's power consumption should be considered in the overall power budget of the system.
  • To troubleshoot issues with the MAX3869EHJ+, start by checking the power supply voltage and ensuring it is within the recommended range. Then, check the input and output signals using an oscilloscope to identify any anomalies. Finally, consult the datasheet and application notes for guidance on troubleshooting common issues.

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MAX3869EHJ+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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