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MAX4172ESA+T - Analog Devices

Description: Low-Cost, Precision, High-Side Current-Sense Amplifier

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MAX4172ESA+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8+4
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MAX4172ESA+T - Analog Devices  - 3D model - Small Outline Packages - S8+4
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MAX4172ESA+T Details

  • Manufacturer Part Number:

    MAX4172ESA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    SOP, SOP8,.25

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1996-12-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    HIGH SIDE POWER/CURRENT MONITOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.6 mA

  • Supply Voltage-Max (Vsup):

    32 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX4172ESA+T Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX4172ESA+T involves keeping the input traces as short as possible, using a ground plane to reduce noise, and placing the device close to the signal source. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to minimize noise and interference.
  • To optimize the performance of the MAX4172ESA+T in a noisy environment, use shielding, filtering, and grounding techniques to reduce electromagnetic interference (EMI). Additionally, use a low-pass filter at the input to remove high-frequency noise, and consider using a differential input configuration to reject common-mode noise.
  • The maximum input voltage that the MAX4172ESA+T can handle is ±25V, but it's recommended to limit the input voltage to ±20V to ensure reliable operation and prevent damage to the device.
  • Calibration of the MAX4172ESA+T involves adjusting the gain and offset of the device to match the specific application requirements. This can be done using external resistors and voltage references, or by using a calibration routine in the microcontroller or FPGA that interfaces with the MAX4172ESA+T.
  • The typical settling time of the MAX4172ESA+T is around 10µs to 20µs, depending on the input signal frequency and amplitude. However, this can vary depending on the specific application and layout.

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MAX4172ESA+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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