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MAX4209HAUA+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX4209HAUA+ - INSTR AMPLIFIER, 750KHZ, 135DB, UMAX-8

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MAX4209HAUA+ - Analog Devices - PCB symbol
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MAX4209HAUA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MAX4209HAUA+
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MAX4209HAUA+ Details

  • Manufacturer Part Number:

    MAX4209HAUA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2007-10-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    BUFFER

  • Input Offset Voltage-Max:

    40 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    80000 V/us

  • Supply Current-Max:

    2.3 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX4209HAUA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX4209HAUA+ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Refer to the application note AN-1149 for more details.
  • The MAX4209HAUA+ requires a dual supply voltage (VCC and VEE) for proper operation. Ensure that VCC is between 2.7V and 5.5V, and VEE is between -2.7V and -5.5V. The input common-mode voltage should be within 1V of the positive supply rail (VCC) for optimal performance.
  • The MAX4209HAUA+ can handle input voltages up to ±6V beyond the supply rails (VCC and VEE) without damage. However, the device is only specified to operate with input voltages within the range of VCC - 0.1V to VCC + 0.1V and VEE - 0.1V to VEE + 0.1V.
  • To reduce noise and oscillations, ensure that the input and output traces are properly terminated, and use decoupling capacitors (e.g., 10nF to 100nF) close to the device. Additionally, use a low-pass filter or a ferrite bead in series with the input signal to filter out high-frequency noise.
  • While the MAX4209HAUA+ is typically used in a dual-supply configuration, it can be used in a single-supply configuration with some limitations. In this case, the input common-mode voltage should be within 1V of the positive supply rail (VCC), and the output voltage swing will be reduced. Refer to the application note AN-1149 for more details.

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MAX4209HAUA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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