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MAX4701ETE+T - Analog Devices

Description: Analog Switch ICs Low-Voltage, Dual DPDT/Quad SPDT Analog Switches in QFN

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MAX4701ETE+T - Analog Devices - PCB symbol
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PCB Footprints
MAX4701ETE+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T1633+4-
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MAX4701ETE+T - Analog Devices - 3D model - Quad Flat No-Lead - T1633+4-
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MAX4701ETE+T Details

  • Manufacturer Part Number:

    MAX4701ETE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-LFCSP-3X3X0.75

  • Package Description:

    HVQCCN, LCC16,.12SQ,20

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-LFCSP-3X3X0.75

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-08-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    76 dB

  • On-state Resistance Match-Nom:

    2 Ω

  • On-state Resistance-Max (Ron):

    75 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    25 ns

  • Switch-on Time-Max:

    45 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX4701ETE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX4701ETE+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The MAX4701ETE+T has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane. Additionally, ensuring good airflow around the device and using a heat sink if necessary can help to keep the device within its operating temperature range.
  • The recommended input capacitor value for the MAX4701ETE+T is 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended due to its low equivalent series resistance (ESR) and high ripple current capability.
  • The MAX4701ETE+T requires a bias voltage of 2.7V to 5.5V, and the device should be configured according to the application requirements. This may involve setting the output voltage, adjusting the current limit, and configuring the enable and shutdown pins. Refer to the datasheet and application notes for specific guidance on configuring the device for your application.
  • Potential failure modes of the MAX4701ETE+T include overvoltage, undervoltage, overcurrent, and overheating. To mitigate these failure modes, ensure that the device is operated within its recommended operating conditions, use proper input and output filtering, and implement overvoltage and overcurrent protection circuits as needed. Additionally, follow proper PCB design and layout practices to minimize the risk of electrical overstress and thermal issues.

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MAX4701ETE+T Overview

Use the download button to access the MAX4701ETE+T schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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