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MAX543ACPA+ - Analog Devices

Description: MAX543ACPA+, 12-Bit 12 Bit DAC SPI, 8-Pin PDIP

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MAX543ACPA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX543ACPA+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8 DIP
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MAX543ACPA+ - Analog Devices - 3D model - Dual-In-Line Packages - 8 DIP
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MAX543ACPA+ Details

  • Manufacturer Part Number:

    MAX543ACPA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-PDIP-300_MIL

  • Package Description:

    PLASTIC, MS-001AB, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-PDIP-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2001-05-16

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.375 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Settling Time-Max:

    1 µs

  • Settling Time-Nom (tstl):

    0.25 µs

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

MAX543ACPA+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX543ACPA+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing bypass capacitors close to the device. A detailed layout guide can be found in the application note AN-1149.
  • To ensure proper power-up and initialization, the MAX543ACPA+ requires a monotonic power supply ramp-up, a minimum supply voltage of 4.5V, and a maximum supply voltage of 5.5V. The device also requires a 10kΩ pull-up resistor on the EN pin to ensure proper enablement.
  • The maximum output current capability of the MAX543ACPA+ is 10mA per channel, with a total output current of 20mA for both channels. However, the output current should be derated based on the ambient temperature and the package thermal resistance.
  • The MAX543ACPA+ can be configured for a specific output voltage by using an external resistor divider network connected to the FB pin. The output voltage can be calculated using the formula VOUT = (R1/R2) * (VREF - VFB), where VREF is the internal reference voltage and VFB is the feedback voltage.
  • The EN pin on the MAX543ACPA+ is an active-high enable input that allows the device to be enabled or disabled. When the EN pin is high, the device is enabled and the output voltage is regulated. When the EN pin is low, the device is disabled and the output voltage is turned off.

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MAX543ACPA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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