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MAX5532EUA+ - Analog Devices

Description: Dual 12-Bit DAC Voltage-Output uMAX8 MAX5532EUA+, 12 bit-Bit DAC Dual, SPI, 8-Pin μMAX

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MAX5532EUA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX5532EUA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8L uMAX/uSOP
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MAX5532EUA+ - Analog Devices - 3D model - Small Outline Packages - 8L uMAX/uSOP
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MAX5532EUA+ Details

  • Manufacturer Part Number:

    MAX5532EUA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-MINI_SO-N/A

  • Package Description:

    MO-187C-AA, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2004-01-23

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    660 µs

  • Supply Current-Max:

    0.006 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX5532EUA+ Frequently Asked Questions (FAQs)

  • The MAX5532EUA+ requires careful layout and placement to minimize noise and ensure optimal performance. It is recommended to place the device close to the power source, use a solid ground plane, and keep the input and output traces short and separate. Additionally, it is recommended to use a 10nF to 100nF bypass capacitor between the VCC and GND pins to filter out high-frequency noise.
  • The MAX5532EUA+ requires a proper power-up sequence to ensure correct operation. It is recommended to power up the device in the following sequence: VCC, then VIN, and finally EN. The EN pin should be pulled high after the VCC and VIN pins have reached their nominal values. Additionally, the device requires a minimum of 1ms power-up time to ensure proper initialization.
  • The MAX5532EUA+ can drive a maximum capacitive load of 10nF. Exceeding this limit may cause the device to oscillate or become unstable. If a larger capacitive load is required, it is recommended to add a series resistor to limit the current and ensure stability.
  • To troubleshoot issues with the MAX5532EUA+, it is recommended to first check the power-up sequence and ensure that the device is properly powered up and initialized. Next, check the input voltage and ensure it is within the recommended range. If the issue persists, check the output voltage and current, and ensure that the device is not overloaded. Finally, check the layout and placement of the device and ensure that it is properly decoupled and shielded from noise.
  • The MAX5532EUA+ can operate in a high-temperature environment, but its performance and reliability may be affected. The device is rated for operation up to 125°C, but its accuracy and stability may degrade above 85°C. It is recommended to derate the device's performance and ensure proper heat sinking and thermal management to prevent overheating.

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MAX5532EUA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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