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MAX5714AUD+ - Analog Devices

Description: Digital to Analog Converters - DAC Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered Output DACs with Internal Reference and SPI Interface

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MAX5714AUD+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - Max 21-0066_M (14 TSSOP)
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MAX5714AUD+ - Analog Devices  - 3D model - Small Outline Packages - Max 21-0066_M (14 TSSOP)
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MAX5714AUD+ Details

  • Manufacturer Part Number:

    MAX5714AUD+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    14-TSSOP_4.4-4.4_MM

  • Pin Count:

    14

  • Manufacturer Package Code:

    14-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2012-07-26

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Linearity Error-Max (EL):

    0.049%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    1.5 mA

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX5714AUD+ Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the MAX5714AUD+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a star topology for the power supply connections and to avoid running digital signals near the analog signals.
  • To ensure the accuracy and stability of the output voltage, it's essential to use high-quality external components, such as low-ESR capacitors and a stable reference voltage. Additionally, the device should be operated within its recommended operating conditions, and the output voltage should be decoupled with a capacitor to filter out any noise.
  • The MAX5714AUD+ can deliver up to 500mA of output current. However, the output voltage may droop or sag if the output current exceeds the recommended maximum current. To minimize this effect, it's recommended to use a larger output capacitor or to add a current buffer stage.
  • The MAX5714AUD+ has built-in input voltage transient protection and brownout detection. It can withstand input voltage transients up to 6V and has a brownout detection threshold of around 2.2V. If the input voltage falls below this threshold, the device will shut down to prevent damage.
  • The thermal shutdown temperature of the MAX5714AUD+ is around 150°C. If the device temperature exceeds this threshold, it will shut down to prevent damage. Once the temperature cools down, the device will automatically restart.

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MAX5714AUD+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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