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MAX5877EGK+TD - Analog Devices

Description: 14-Bit, 250Msps, High-Dynamic-Performance, Dual DAC with LVDS Inputs

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PCB Footprints
MAX5877EGK+TD - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 68 QFN-EP
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3D Models
MAX5877EGK+TD - Analog Devices  - 3D model - Quad Flat No-Lead - 68 QFN-EP
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MAX5877EGK+TD Details

  • Manufacturer Part Number:

    MAX5877EGK+TD

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    68-LFCSP-10X10X0.85

  • Package Description:

    HVQCCN, LCC68,.4SQ,20

  • Pin Count:

    68

  • Manufacturer Package Code:

    68-LFCSP-10X10X0.85

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2005-05-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Output Voltage-Max:

    1.1 V

  • Analog Output Voltage-Min:

    -0.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-XQCC-N68

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    68

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC68,.4SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Settling Time-Nom (tstl):

    0.014 µs

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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MAX5877EGK+TD Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image MAX5877EGK+TD Maxim Integrated Products

D/A Converter, 1 Func, Parallel, Word Input Loading, 0.014us Settling Time, QCC68