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MAX6502UKP085+T - Analog Devices

Description: Board Mount Temperature Sensors 2.7-5.5V uPower Temperature Switch

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MAX6502UKP085+T - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5 SOT23-5  21-0057
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MAX6502UKP085+T - Analog Devices  - 3D model - SOT23 (5-Pin) - 5 SOT23-5  21-0057
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MAX6502UKP085+T Details

  • Manufacturer Part Number:

    MAX6502UKP085+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    5-SOT_23-N/A

  • Package Description:

    LSSOP,

  • Pin Count:

    5

  • Manufacturer Package Code:

    5-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1997-09-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

MAX6502UKP085+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX6502UKP085+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and parasitic inductance. A 4-layer PCB with a dedicated power plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, a minimum of 1uF capacitance on the output is recommended to ensure stability.
  • The MAX6502UKP085+T has an operating temperature range of -40°C to +125°C. However, the maximum ambient temperature range depends on the specific application and the device's power dissipation. It's recommended to consult the thermal management section of the datasheet for more information.
  • The MAX6502UKP085+T is a commercial-grade device, but Analog Devices Inc offers other versions of the device that are specifically designed for high-reliability or aerospace applications. These devices have undergone additional testing and screening to ensure their reliability in harsh environments.
  • To troubleshoot issues with the MAX6502UKP085+T, start by verifying the input voltage, output voltage, and component values. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to check for noise and oscillations on the output. Consult the datasheet and application notes for more troubleshooting guidance.

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MAX6502UKP085+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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