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MAX6951EEE+ - Analog Devices

Description: LED Driver 64Segment 3.3V/5V

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MAX6951EEE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 21-0063 A
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MAX6951EEE+ - Analog Devices  - 3D model - Small Outline Packages - 21-0063 A
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MAX6951EEE+ Details

  • Manufacturer Part Number:

    MAX6951EEE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    0.150 INCH, 0.025 INCH PITCH, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2001-10-23

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    COMMON-CATHODE

  • Data Input Mode:

    SERIAL

  • Display Mode:

    SEGMENT

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    YES

  • Number of Digits/Characters:

    8-DIGIT

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    8 MHz

MAX6951EEE+ Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the MAX6951EEE+ involves keeping the power and ground pins as close as possible to the device, using a solid ground plane, and minimizing the length of the traces to reduce noise and EMI. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation of the MAX6951EEE+ in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • When using the MAX6951EEE+ in a system with multiple power domains, it's essential to ensure that the device is powered from a single power domain to avoid voltage conflicts and potential damage to the device. Additionally, the power-up and power-down sequences should be carefully managed to prevent voltage glitches and ensure reliable operation.
  • To troubleshoot issues with the MAX6951EEE+ not communicating with the microcontroller, check the following: ensure that the device is properly powered and configured, verify that the clock and data lines are properly connected and terminated, check the serial communication protocol and baud rate, and use a logic analyzer or oscilloscope to debug the communication signals.
  • When using the MAX6951EEE+ in a system with high levels of electromagnetic interference (EMI), it's essential to follow proper EMI mitigation practices, such as using shielding, filtering, and grounding techniques to reduce the impact of EMI on the device. Additionally, the device should be placed in a location that minimizes its exposure to EMI sources, and the PCB layout should be designed to minimize radiation and susceptibility to EMI.

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MAX6951EEE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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