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MAX77540AAFG+T - Analog Devices

Description: 16VIN/6A, Dual-Phase High-Efficiency Buck Converter

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MAX77540AAFG+T - Analog Devices - PCB symbol
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PCB Footprints
MAX77540AAFG+T - Analog Devices PCB footprint - Other - Other - F243A3F+2_2022
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3D Models
MAX77540AAFG+T - Analog Devices - 3D model - Other - F243A3F+2_2022
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MAX77540AAFG+T Details

  • Manufacturer Part Number:

    MAX77540AAFG+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-LFCSP-3X3X0.55

  • Package Description:

    FC2QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-LFCSP-3X3X0.55

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2021-09-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    5V FIXED OUTPUT ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    5.2 V

  • Output Voltage-Min:

    0.5 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC24,.12SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1600 kHz

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX77540AAFG+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX77540AAFG+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to reduce noise and improve performance.
  • To ensure proper thermal management of the MAX77540AAFG+T, it's recommended to provide a thermal pad on the PCB, connect it to a solid ground plane, and use a heat sink if necessary. The device's thermal pad should be soldered to the PCB to provide a good thermal connection. Additionally, the PCB should be designed to allow for good airflow around the device.
  • The recommended input capacitor value for the MAX77540AAFG+T is 10uF to 22uF, with a voltage rating of at least 6.3V. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended due to its low equivalent series resistance (ESR) and high ripple current capability.
  • To troubleshoot issues with the MAX77540AAFG+T, start by checking the input voltage and current, as well as the output voltage and current. Verify that the input and output capacitors are properly connected and meet the recommended specifications. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for any noise or oscillations on the output voltage. If the issue persists, consult the datasheet and application notes for further guidance.
  • The MAX77540AAFG+T is rated for operation up to 125°C, but its performance and reliability may be affected at high temperatures. It's recommended to derate the device's output current and voltage at high temperatures to ensure reliable operation. Additionally, the PCB should be designed to withstand high temperatures, and the device should be properly thermally managed to prevent overheating.

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MAX77540AAFG+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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