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MAX77857BEWB+ - Analog Devices

Description: 2.5V to 16V Input, 7A Switching Current High-Efficiency Buck-Boost Converter

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MAX77857BEWB+ - Analog Devices - PCB symbol
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PCB Footprints
MAX77857BEWB+ - Analog Devices PCB footprint - BGA - BGA - W352A2+1
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3D Models
MAX77857BEWB+ - Analog Devices - 3D model - BGA - W352A2+1
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MAX77857BEWB+ Details

  • Manufacturer Part Number:

    MAX77857BEWB+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    35-WLCSP-N/A

  • Package Description:

    WLP-35

  • Pin Count:

    35

  • Manufacturer Package Code:

    35-WLCSP-N/A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2022-03-16

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    7.6 V

  • JESD-30 Code:

    R-XBGA-B35

  • Length:

    2.828 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    35

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    15 V

  • Output Voltage-Min:

    3 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA35,5X7,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2270 kHz

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.028 mm

MAX77857BEWB+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX77857BEWB+ can be found in the MAX77857 Evaluation Kit documentation, which provides a detailed layout guide and Gerber files for reference. Additionally, Analog Devices provides a PCB layout checklist in the datasheet that highlights key considerations for optimal performance.
  • To optimize the performance of the MAX77857BEWB+, it's essential to follow the recommended layout and component selection guidelines in the datasheet. Additionally, Analog Devices provides an application note (AN-2153) that provides detailed guidance on optimizing the performance of the MAX77857BEWB+ in various applications.
  • The maximum input voltage that the MAX77857BEWB+ can handle is 22V, as specified in the datasheet. However, it's essential to ensure that the input voltage does not exceed this maximum rating to prevent damage to the device.
  • The MAX77857BEWB+ is rated for operation up to 125°C, but it's essential to ensure that the device is properly derated for high-temperature operation. Analog Devices provides a thermal derating chart in the datasheet to help designers determine the maximum power dissipation at elevated temperatures.
  • Analog Devices provides a troubleshooting guide in the datasheet that covers common issues and their solutions. Additionally, the MAX77857 Evaluation Kit documentation provides a detailed troubleshooting guide that covers common issues and their solutions.

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MAX77857BEWB+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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