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MAX9174EUB+ - Analog Devices

Description: Maxim MAX9174EUB+, LVDS Repeater Triple 2-Bits LVCMOS/ LVTTL LVDS, 10-Pin, μMAX

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MAX9174EUB+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 10 µMAX
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MAX9174EUB+ - Analog Devices  - 3D model - Small Outline Packages - 10 µMAX
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MAX9174EUB+ Details

  • Manufacturer Part Number:

    MAX9174EUB+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    10-MINI_SO-N/A

  • Package Description:

    SSOP-16

  • Pin Count:

    10

  • Manufacturer Package Code:

    10-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2003-05-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Family:

    9174

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    35 mA

  • Prop. Delay@Nom-Sup:

    3.23 ns

  • Propagation Delay (tpd):

    3.23 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.045 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    670 MHz

MAX9174EUB+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX9174EUB+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, while the output capacitor (COUT) should be a low-ESR ceramic or tantalum capacitor with a value between 1uF to 22uF. The capacitor values and types may vary depending on the specific application and operating conditions.
  • The MAX9174EUB+ has an operating temperature range of -40°C to +125°C, making it suitable for a wide range of industrial and automotive applications.
  • The MAX9174EUB+ has a specific power-up and power-down sequence that must be followed to ensure proper operation. The device should be powered up by applying the input voltage (VIN) before the enable signal (EN), and powered down by removing the enable signal before the input voltage.
  • The typical startup time for the MAX9174EUB+ is around 1ms, but this can vary depending on the specific application and operating conditions.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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