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MAX9867ETJ+G3U - Analog Devices

Description: Interface - CODECs Ultra-Low Power Stereo Audio Codec 1.65V ~ 1.95V , -40°C to +85°C

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MAX9867ETJ+G3U - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T3255+4_2025-1.1
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MAX9867ETJ+G3U - Analog Devices  - 3D model - Quad Flat No-Lead - T3255+4_2025-1.1
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MAX9867ETJ+G3U Details

  • Manufacturer Part Number:

    MAX9867ETJ+G3U

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    32-LFCSP-5X5X0.75

  • Package Description:

    TQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2009-06-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Filter:

    YES

  • Input Type:

    SINGLE-ENDED; DIFF

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    VOLTAGE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    PCM CODEC

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX9867ETJ+G3U Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX9867ETJ+G3U can be found in the MAX9867 Evaluation Kit documentation, which includes a layout guide and Gerber files. Additionally, Analog Devices provides a PCB layout checklist in the device's datasheet.
  • To optimize the performance of the MAX9867ETJ+G3U, it is recommended to follow the application notes and design guidelines provided by Analog Devices. Additionally, engineers can use simulation tools such as SPICE models and evaluation boards to test and optimize their design.
  • The MAX9867ETJ+G3U has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. The device's junction-to-ambient thermal resistance (θJA) is 30°C/W, and the maximum junction temperature is 150°C. Engineers should ensure that their PCB design and thermal management strategy can keep the device within its recommended operating temperature range.
  • Yes, the MAX9867ETJ+G3U is suitable for battery-powered devices due to its low power consumption. The device has a low quiescent current of 1.2mA and a shutdown current of 1μA, making it suitable for battery-powered applications. However, engineers should ensure that their power management strategy can handle the device's power requirements.
  • To troubleshoot issues with the MAX9867ETJ+G3U, engineers can use the device's built-in diagnostic features, such as the fault detection and reporting mechanism. Additionally, Analog Devices provides a troubleshooting guide in the device's datasheet, as well as application notes and FAQs on their website.

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MAX9867ETJ+G3U Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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