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MAX9926UAEE+T - Analog Devices

Description: Sensor Interface Variable-Reluctance Sensor Interface

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MAX9926UAEE+T - Analog Devices - PCB symbol
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MAX9926UAEE+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - QSOP16
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MAX9926UAEE+T - Analog Devices - 3D model - Small Outline Packages - QSOP16
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MAX9926UAEE+T Details

  • Manufacturer Part Number:

    MAX9926UAEE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    0.150 INCH, 0.025 INCH PITCH, ROHS COMPLIANT, MO-137, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2008-11-21

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX9926UAEE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX9926UAEE+T involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the device's exposed pad should be connected to a solid ground plane to improve thermal performance.
  • The values of R1 and R2 depend on the desired gain and bandwidth of the amplifier. A higher gain requires smaller resistor values, while a higher bandwidth requires larger resistor values. The datasheet provides a formula to calculate the gain and bandwidth based on R1 and R2 values. Typically, R1 is in the range of 1kΩ to 10kΩ, and R2 is in the range of 10kΩ to 100kΩ.
  • The maximum input voltage that the MAX9926UAEE+T can handle is ±20V, but it's recommended to keep the input voltage within ±15V to ensure optimal performance and prevent damage to the device.
  • The MAX9926UAEE+T is specified to operate from -40°C to +125°C. To ensure operation within this range, the device should be mounted on a PCB with a good thermal design, and the ambient temperature should be kept within the specified range. Additionally, the device's power dissipation should be kept within the specified limits to prevent overheating.
  • The recommended power-up sequence for the MAX9926UAEE+T is to apply the power supply voltage (VCC) before applying the input signal. This ensures that the device is properly biased and configured before the input signal is applied.

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MAX9926UAEE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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