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MAXM17635AMG+ - Analog Devices

Description: 4.5V to 36V, 2A Himalaya uSLIC Step-Down Power Modules , Surface Mount , 710 uA , 2.2 MHz , -40 °C to + 125 °C

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MAXM17635AMG+ - Analog Devices - PCB symbol
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PCB Footprints
MAXM17635AMG+ - Analog Devices PCB footprint - Other - Other - M244A4+1_2026-1.5
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3D Models
MAXM17635AMG+ - Analog Devices - 3D model - Other - M244A4+1_2026-1.5
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MAXM17635AMG+ Details

  • Manufacturer Part Number:

    MAXM17635AMG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-CSP_BGA_EM-4X4X1.55

  • Package Description:

    USLIC-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-CSP_BGA_EM-4X4X1.55

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-02-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    PULSE FREQUENCY MODULATION TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    S-XQMA-N24

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    12 V

  • Output Voltage-Min:

    0.9 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QMA

  • Package Equivalence Code:

    MODULE,24LEAD,.15

  • Package Shape:

    SQUARE

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2450 kHz

  • Technology:

    HYBRID

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAXM17635AMG+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAXM17635AMG+ can be found in the MAXM17635 Evaluation Kit documentation, which provides a detailed layout guide and Gerber files for reference. Additionally, Analog Devices provides a PCB layout checklist in the device's datasheet.
  • To optimize the performance of the MAXM17635AMG+, it's essential to follow the recommended layout and component selection guidelines in the datasheet. Additionally, consider the input and output filtering requirements, and ensure that the device is operated within its recommended operating conditions. You can also consult with Analog Devices' application engineers for customized support.
  • The MAXM17635AMG+ has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. The device's junction-to-case thermal resistance (RθJC) is 2.5°C/W, and the junction-to-ambient thermal resistance (RθJA) is 30°C/W. Ensure that the PCB design and thermal management strategy can handle the device's power dissipation.
  • The MAXM17635AMG+ is rated for operation from -40°C to +125°C. However, the device's performance and reliability may degrade at higher temperatures. Consult with Analog Devices' application engineers to discuss specific temperature requirements and potential derating considerations.
  • To troubleshoot issues with the MAXM17635AMG+, start by reviewing the device's datasheet and application notes. Check the power supply, input and output voltages, and ensure that the device is properly configured. Use oscilloscopes and other diagnostic tools to identify potential issues. If needed, consult with Analog Devices' application engineers for further support.

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MAXM17635AMG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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