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MB2S - onsemi

Description: Ideal for Printed Circuit Board; Surge Overload Rating: 35 A Peak; Low-Leakage; UL Certified: UL #E258596

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MB2S - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC4 W CASE 751EP ISSUE O
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MB2S - onsemi  - 3D model - Small Outline Packages - SOIC4 W CASE 751EP ISSUE O
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MB2S Details

  • Manufacturer Part Number:

    MB2S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC4 W

  • Package Description:

    SOIC-4

  • Manufacturer Package Code:

    751EP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.4 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MB2S Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage.
  • Yes, the MB2S can be used as a synchronous rectifier. However, ensure that the device is properly biased and the gate drive is sufficient to minimize switching losses.
  • Use a shielded layout, keep the switching node (drain-source) as short as possible, and use a common-mode choke or ferrite bead to reduce EMI.

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MB2S Overview

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Part Image MB2S-BP Micro Commercial Components

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Part Image MB2S_NL Fairchild Semiconductor Corporation

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Part Image MB2S General Instrument Corp

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