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MB6S - onsemi

Description: Ideal for Printed Circuit Board; UL Certified: UL #E258596; Surge Overload Rating: 35 A Peak; Low-Leakage

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MB6S - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC4 W CASE 751EP ISSUE O
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MB6S - onsemi  - 3D model - Small Outline Packages - SOIC4 W CASE 751EP ISSUE O
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MB6S Details

  • Manufacturer Part Number:

    MB6S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC4 W

  • Package Description:

    SOIC-4

  • Manufacturer Package Code:

    751EP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.4 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MB6S Frequently Asked Questions (FAQs)

  • The MB6S can operate from -40°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • The MB6S requires a bias voltage of 5V to 15V, and the recommended bias current is 1mA to 10mA. Ensure the bias circuit is designed to provide a stable voltage and current.
  • Use a multi-layer PCB with a solid ground plane, and ensure good thermal conductivity between the device and the PCB. A thermal pad or heat sink may be necessary for high-power applications.
  • Use ESD protection devices, such as TVS diodes or ESD protection arrays, and follow proper handling and storage procedures to prevent ESD damage.
  • The maximum power dissipation for the MB6S is 1W, but this can be increased with proper heat sinking and thermal management.

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MB6S Overview

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