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MBASU105SCG080CFNA01 - TAIYO YUDEN

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 8pF C0G 0402 0.55T Telecomm 2Term

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MBASU105SCG080CFNA01 - TAIYO YUDEN - PCB symbol
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PCB Footprints
MBASU105SCG080CFNA01 - TAIYO YUDEN PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 0402 (1005 Metric)_2024
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3D Models
MBASU105SCG080CFNA01 - TAIYO YUDEN - 3D model - Capacitor Chip Non-polarised - 0402 (1005 Metric)_2024
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MBASU105SCG080CFNA01 Details

  • Manufacturer Part Number:

    MBASU105SCG080CFNA01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Capacitance:

    0.000008 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    3.12%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Packing Method:

    TR, PAPER, 7 INCH

  • Positive Tolerance:

    3.12%

  • Rated (DC) Voltage (URdc):

    50 V

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

MBASU105SCG080CFNA01 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MBASU105SCG080CFNA01 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm, and a non-solder mask defined (NSMD) pad.
  • The MBASU105SCG080CFNA01 is rated for operation up to 125°C, but it's recommended to derate the voltage and current according to the temperature derating curve provided in the datasheet. Additionally, ensure that the component is properly cooled to prevent thermal runaway.
  • Handle the component by the edges or the recommended handling areas to prevent damage to the internal components. Avoid touching the component's terminals or applying excessive force, which can cause damage or electrical shorts.
  • The recommended soldering profile for MBASU105SCG080CFNA01 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • The MBASU105SCG080CFNA01 is rated for operation in environments with a relative humidity of up to 60% at 40°C. However, it's recommended to take precautions to prevent moisture ingress, such as using a conformal coating or sealing the component in a moisture-resistant package.

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MBASU105SCG080CFNA01 Overview

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