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MBR1060 - Taiwan Semiconductor

Description: TAIWAN SEMICONDUCTOR - MBR1060 - SCHOTTKY RECTIFIER, 10A, 60V, TO-220AC

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PCB Footprints
MBR1060 - Taiwan Semiconductor PCB footprint - Other - Other - TO-220AC
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MBR1060 - Taiwan Semiconductor  - 3D model - Other - TO-220AC
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MBR1060 Details

  • Manufacturer Part Number:

    MBR1060

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    5.82

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MBR1060 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a solid copper plane on the bottom layer of the PCB, directly underneath the MBR1060, to act as a heat sink. Additionally, it is recommended to use thermal vias to connect the top and bottom layers, and to keep the PCB traces away from the thermal pad to minimize thermal resistance.
  • To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, it is important to ensure good thermal design and heat sinking, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum allowable voltage stress on the MBR1060 is 1.5 times the maximum rated voltage, but it is recommended to limit the voltage stress to 1.2 times the maximum rated voltage to ensure reliable operation and to prevent damage to the device.
  • To handle ESD protection for the MBR1060, it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and to use ESD protection devices such as TVS diodes or ESD protection arrays on the PCB. Additionally, it is recommended to use a PCB layout that minimizes the distance between the MBR1060 and the ESD protection devices.
  • The recommended storage condition for the MBR1060 is in a dry, cool place, away from direct sunlight and moisture. The device should be stored in its original packaging or in a similar antistatic package, and should not be exposed to temperatures above 30°C or humidity above 60%.

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MBR1060 Overview

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Part Image MBR1060G Taiwan Semiconductor

Rectifier Diode, Schottky, 1 Phase, 1 Element, 10A, 60V V(RRM), Silicon, TO-220AC,

Part Image SR1060 Galaxy Microelectronics

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Part Image SB1060 Won-Top Electronics Co Ltd

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Part Image MBR1060 Motorola Semiconductor Products

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Part Image MBR10H60-E3/45 Vishay Semiconductors

DIODE 10 A, 60 V, SILICON, RECTIFIER DIODE, TO-220AC, ROHS COMPLIANT, PLASTIC PACKAGE-2, Rectifier Diode

For a full list of alternate parts for MBR1060, check out Findchips.com