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MBR130T1G - onsemi

Description: Guardring for Stress Protection; Low Forward Voltage; 125°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model, C; Human Body Model, 3 Mechanical Characteristics; Reel Options: MBR130T1 = 3,000 per 7, reel/8 mm tape MBR130T3 = 10,000 per 13, reel/8 mm tape; Device Marking: B13; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant a

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MBR130T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MBR130T1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MBR130T1G Details

  • Manufacturer Part Number:

    MBR130T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    5.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBR130T1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBR130T1G is -65°C to 150°C.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, ensure the PCB is designed with a suitable thermal relief pattern to prevent thermal stress on the component.
  • The recommended storage condition for the MBR130T1G is in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%.
  • Yes, the MBR130T1G is suitable for high-frequency switching applications due to its low forward voltage drop and fast switching characteristics. However, ensure the circuit is designed to minimize ringing and oscillations.
  • To prevent ESD damage, handle the MBR130T1G with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the component pins or leads with bare hands.

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MBR130T1G Overview

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