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MBR15100CT - Taiwan Semiconductor

Description: Taiwan Semi MBR15100CT, Dual Schottky Diode, Common Cathode, 100V 15A, 3-Pin TO-220AB

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MBR15100CT - Taiwan Semiconductor - PCB symbol
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PCB Footprints
MBR15100CT - Taiwan Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB_2021
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3D Models
MBR15100CT - Taiwan Semiconductor - 3D model - Transistor Outline, Vertical - TO-220AB_2021
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MBR15100CT Details

  • Manufacturer Part Number:

    MBR15100CT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    5.32

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.92 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61249-2-21

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MBR15100CT Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the manufacturer's application note for detailed layout guidelines.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended operating conditions. Derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, but ensure that the device is operated within its recommended frequency range and follow the manufacturer's guidelines for high-frequency operation. Additionally, consider the effects of parasitic inductance and capacitance on the device's performance.
  • Store the devices in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, and the relative humidity should be below 60%.

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MBR15100CT Overview

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