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MBR30150FCT-BP - MCC

Description: Schottky Barrier Rectifiers

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MBR30150FCT-BP - MCC - PCB symbol
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PCB Footprints
MBR30150FCT-BP - MCC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ITO-220ABs
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3D Models
MBR30150FCT-BP - MCC - 3D model - Transistor Outline, Vertical - ITO-220ABs
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MBR30150FCT-BP Details

  • Manufacturer Part Number:

    MBR30150FCT-BP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ITO-220AB, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.82

  • Additional Feature:

    LOW POWER LOSS, FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    260 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MBR30150FCT-BP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MBR30150FCT-BP is a standard SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the MBR30150FCT-BP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device, and avoid applying excessive force or pressure to the device during soldering.
  • The MBR30150FCT-BP should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 40% to 60%. Avoid storing the device in direct sunlight or near sources of moisture or radiation.
  • Yes, the MBR30150FCT-BP is suitable for high-frequency applications up to 1MHz. However, the device's performance may degrade at frequencies above 500kHz, and additional filtering or decoupling may be required to ensure proper operation.

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MBR30150FCT-BP Overview

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