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MBR5H100MFST3G - onsemi

Description: Obsolete - 45 V, 60 A Schottky Rectifier

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PCB Footprints
MBR5H100MFST3G - onsemi PCB footprint - Other - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE M
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3D Models
MBR5H100MFST3G - onsemi  - 3D model - Other - DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE M
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MBR5H100MFST3G Details

  • Manufacturer Part Number:

    MBR5H100MFST3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN5 5X6, 1.27P (SO 8FL)

  • Pin Count:

    5

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MBR5H100MFST3G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBR5H100MFST3G is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating curves, ensure proper thermal management, and consider the device's power dissipation and thermal resistance.
  • The recommended footprint and land pattern for the MBR5H100MFST3G can be found in the onsemi application note AND8321/D, which provides detailed guidelines for PCB design and layout.
  • It's crucial to follow proper electrostatic discharge (ESD) precautions, use appropriate handling and storage procedures, and ensure that the device is properly soldered and connected to prevent damage or electrical overstress.
  • The recommended soldering conditions for the MBR5H100MFST3G are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C.

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MBR5H100MFST3G Overview

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