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MBR745G - onsemi

Description: Case: Epoxy, Molded; 150 C Operating Junction Temperature; Low Forward Voltage; Weight: 1.9 grams (approximately); Epoxy Meets UL94, VO at 1/8" Mechanical Characteristics:; Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds; Guardring for Stress Protection; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Pb-Free Packages are Available

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MBR745G - onsemi - PCB symbol
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PCB Footprints
MBR745G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 CASE221B-042-1
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3D Models
MBR745G - onsemi - 3D model - Transistor Outline, Vertical - TO-220 CASE221B-042-1
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