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MBR745PBF - Vishay

Description: Schottky Diodes & Rectifiers 7.5 Amp 45 Volt

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Symbol
MBR745PBF - Vishay - PCB symbol
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PCB Footprints
MBR745PBF - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AC_2
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3D Models
MBR745PBF - Vishay - 3D model - Transistor Outline, Vertical - TO-220AC_2
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MBR745PBF Details

  • Manufacturer Part Number:

    MBR745PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AC

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Application:

    HIGH POWER

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.84 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    690 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MBR745PBF Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MBR745PBF is a standard SOT-23 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the PCB is clean and free of oxidation.
  • The maximum allowable power dissipation for the MBR745PBF is 1.5 W at a temperature of 25°C, with a derating of 12.5 mW/°C above 25°C. Ensure proper thermal management to prevent overheating.
  • Yes, the MBR745PBF is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured with a high-reliability process. However, ensure you follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • Handle the MBR745PBF with ESD-sensitive precautions, such as using an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or exposing it to static electricity.

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MBR745PBF Overview

Use the download button to access the MBR745PBF schematic symbol, PCB footprint, and 3D model.
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