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MBR8U60-TP - MCC

Description: Schottky Barrier Rectifiers 60 V 8A Surface Mount TO-277

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MBR8U60-TP - MCC PCB footprint - Other - Other - MBR8U60-TP
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MBR8U60-TP Details

  • Manufacturer Part Number:

    MBR8U60-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    45 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MBR8U60-TP Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MBR8U60-TP is -55°C to 150°C.
  • Yes, the MBR8U60-TP is designed for high-reliability applications and is qualified to aerospace and defense standards.
  • The typical forward voltage drop of the MBR8U60-TP is around 0.8V to 1.2V, depending on the operating current.
  • Yes, the MBR8U60-TP can be used in parallel to increase current handling, but it's essential to ensure that the devices are properly matched and thermally coupled to avoid uneven current sharing.
  • The recommended PCB footprint and layout for the MBR8U60-TP can be found in the manufacturer's application note or datasheet, and typically involves a thermal pad and multiple vias for heat dissipation.

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MBR8U60-TP Overview

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