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MBRB1045CT-TP - MCC

Description: 10 Amp Schottky Barrier Rectifier 30 to 60 Volts

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MBRB1045CT-TP - MCC - PCB symbol
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MBRB1045CT-TP - MCC PCB footprint - Other - Other - MBRB1045CT-TP-2
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MBRB1045CT-TP - MCC - 3D model - Other - MBRB1045CT-TP-2
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MBRB1045CT-TP Details

  • Manufacturer Part Number:

    MBRB1045CT-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.32

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    125 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    100 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

MBRB1045CT-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MBRB1045CT-TP is a standard SOT23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm.
  • Yes, MBRB1045CT-TP is rated for operation up to 150°C, but it's recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet.
  • To ensure reliability, follow proper PCB design and layout guidelines, use a robust soldering process, and perform thorough testing and inspection. Additionally, consider using a moisture-sensitive device (MSD) handling procedure to prevent damage during storage and handling.
  • Yes, MBRB1045CT-TP is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's recommended soldering profile and temperature limits to ensure reliable assembly.
  • The typical failure mode of MBRB1045CT-TP is thermal overload, which can cause the device to fail open or short. Other failure modes may include electrical overstress, moisture ingress, or mechanical stress.

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MBRB1045CT-TP Overview

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