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MBRB2545CT-TP - MCC

Description: 25 Amp Schottky Barrier Rectifier 20 to 60 Volts

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MBRB2545CT-TP - MCC - PCB symbol
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PCB Footprints
MBRB2545CT-TP - MCC PCB footprint - Other - Other - MBRB2545CT-TP-2
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3D Models
MBRB2545CT-TP - MCC - 3D model - Other - MBRB2545CT-TP-2
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MBRB2545CT-TP Details

  • Manufacturer Part Number:

    MBRB2545CT-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-263

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.32

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    200 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

MBRB2545CT-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MBRB2545CT-TP is a standard SOT-23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
  • Yes, MBRB2545CT-TP is rated for operation up to 150°C, but it's recommended to derate the power dissipation according to the temperature derating curve in the datasheet.
  • To ensure reliability, follow proper PCB design and layout guidelines, use a robust soldering process, and perform thorough testing and inspection. Additionally, consider using a moisture-sensitive device handling procedure to prevent damage during storage and handling.
  • Yes, MBRB2545CT-TP is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's recommended soldering profile and temperature limits to prevent damage.
  • The typical failure mode of MBRB2545CT-TP is thermal overload, which can cause the device to fail short or open. Other failure modes may include electrical overstress, electrostatic discharge, or mechanical stress.

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MBRB2545CT-TP Overview

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