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MBRB3060CT-TP - MCC

Description: Diode Array 1 Pair Common Cathode 60 V 30A Surface Mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB

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MBRB3060CT-TP - MCC - PCB symbol
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MBRB3060CT-TP - MCC PCB footprint - Other - Other - MBRB3060CT-TP
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MBRB3060CT-TP - MCC - 3D model - Other - MBRB3060CT-TP
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MBRB3060CT-TP Details

  • Manufacturer Part Number:

    MBRB3060CT-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.38

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.72 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

MBRB3060CT-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MBRB3060CT-TP is a rectangular pad with dimensions of 3.3mm x 1.3mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the MBRB3060CT-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The MBRB3060CT-TP has a maximum surge current rating of 100A for 10ms, making it suitable for applications that require high surge current capability.
  • Yes, the MBRB3060CT-TP can be used in parallel to increase current handling capability, but it is essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

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MBRB3060CT-TP Overview

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